Summary
Academic Background
PhD
(MECHANICAL ENGINEERING) Universiti Sains Malaysia
June 01, 2018 - June 01, 2023
Honours and Awards
Publications
Thermal Characterization of Silver-Based Conductive Polymers for Flexible Electronics
January 25, 2025
Scientific Research Journal - Vol 22, Special issue, Pages 1-18
Structural Assessment of Silver Conductive Ink using Nanoindentation
May 02, 2024
Journal of Current Science and Technology - Volume 14, No. 2, Article Number 37
Optimizing ageing conditions for commercial NiTi archwires: Insights from thermal phase transformation and tensile deformation analysis
March 30, 2024
Journal of Mechanical Engineering and Sciences - Volume 18, Issue 1, Pages 9845-9852
Hyper-elastic characterization of Polydimethylsiloxane by optimization algorithms and finite element methods
March 15, 2024
Arabian Journal for Science and Engineering - Pages 1-23
Understanding the Force Deflection Behavior of NiTi Archwire at Distinct Bending Configuration: A Narrative Review in Vitro Studies
February 29, 2024
Engineering Journal - Volume:28, Issue:2, Page:15-27
Numerical Analysis and Validation of Characterization of Polydimethylsiloxane Using Hyper-elastic Constitutive Models
October 09, 2023
Pertanika Journal of Science and Technology - Volume 31, Issue 6, Pages 3059-3075
Mechanical Analysis and Constitutive Modeling of Nonlinear Behavior of Silver-based Conductive Ink
September 26, 2023
International Journal of Automotive and Mechanical Engineering - Volume 20, Issue 3, Pages 10635-10648
Analysis and Characterization of Polydimethylsiloxane (PDMS) Substrate by using Uniaxial Tensile Test and Mooney-Rivlin Hyperelastic Model
April 29, 2022
Journal of Advanced Manufacturing Technology (JAMT) - Volume 16, No. 1, Pages 61-72
Alternative manufacturing process of 3-dimensional interconnect device using thermoforming process
December 01, 2021
Microelectronics Reliability - Volume 127, Article Number 114373
Structural Analysis and Material Characterization of Silver Conductive Ink for Stretchable Electronics
September 30, 2021
International Journal of Integrated Engineering - Volume 13, Issue 5, Pages 128-135
Stress analysis of stretchable conductive polymer for electronics circuit application
August 08, 2020
Handbook of Materials Failure Analysis: With Case Studies from the Electronic and Textile Industries - Chapter 8, Pages 205-224
Conferences
Validation of Experimental Analysis of the PC Thermoformed Product Using Finite Element Methods
December 07, 2022 - December 08, 2022
Sana Zulfiqar, Abdullah Aziz Saad, Mohd Fikri Mohd Sharif, Z Samsuddin, Mohd Yusuf Tura Ali, Fakhrozi Che Ani, Zulkifli Ahmed, Muhammad Khalil Abdullah,
4th International Conference on Vibration, Sound and System Dynamics (ICVSSD 2022)
Structural Analysis of Silver-Based Conductive Ink Under Cyclic Loading
September 13, 2022 - September 14, 2022
Sana Zulfiqar, Abdullah Aziz Saad, Zulkifli Ahmed, Feizal Yusof, Zuraihana Bachok,
Green Materials and Electronic Packaging Interconnect Technology Symposium
GRADUATE RESEARCH ASSISTANT (GRA)
UNIVERSITI SAINS MALAYSIA (USM)
January 01, 2019 - December 01, 2022
LECTURER
UET, TAXILA
March 01, 2012 - November 01, 2018
PROJECT ENGINEER
M.G. ENGINEERING ASSOCIATES, KARACHI
July 01, 2009 - October 22, 2009
TRAINEE ENGINEER-HSE
PAKISTAN PTA, PORT QASIM, KARACHI
August 08, 2008 - June 09, 2009